2017 Magazine Archives

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FEATURES

STANDARDS
The Reflow Balancing Act
The biggest challenge for developing the profile is all components must meet the same minimum and maximum temperature requirements, even though their thermal masses are  different. A new IPC standard outlines how to overcome this for machine soldering.
by Ray Prasad

SOLDER MATERIALS
Improving the PCB Assembly Manufacturing Process by an Alternative Solder Paste: A Statistical Evaluation
An evaluation of solder paste printing performance of a novel Pb-free solder paste compared to traditional solder materials under harsh environments across a range of components as small as 01005. A detailed statistical analysis identifies the relationship between the condition of the solder paste and paste volume on the pad.
by Dr. Denis Barbini

FIRST PERSON

• CAVEAT LECTOR
  Overcertification is standard fare.
  Mike Buetow

MONEY MATTERS

• ROI
  Shades of 1933?
  Peter Bigelow
  

• GLOBAL SOURCING
  Going abroad.
  Greg Papandrew

TECH TALK

• TECH TIPS
  Tweaking the prints.
  Timothy O’Neill
• GETTING LEAN
  Let’s talk – efficiently!
  Curtis Campbell
• TEST AND INSPECTION
  Break ’em up! Or not.
  Robert Boguski
• DEFECTS DATABASE
  Don’t lose your cap.
  Martin Wickham