2017 Magazine Archives

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FEATURES

PLATING
Black Pad Revisited
Black pad is often the root cause of solderability issues. How do you differentiate it from other soldering defects?  And why should you care?
by Martine Simard-Normandin and Christina Banks

PURCHASING
Industry 4.0 and Supply Chain Disruption
A pure electronic data interchange (EDI) model works well for projects that are up and running, assuming no constraints. The challenge comes when component demand exceeds capacity – and it is.
by Wally Johnson

SOURCING
Navigating Supply Chain Disruption: One EMS Provider’s Approach
With lead times for some parts out to 63 weeks, understanding planning tools and methods becomes more critical than ever.
by Priyanka Dobriyal

'Pushing the Cart': 25 Years of Zestron
As it reaches its silver anniversary, the cleaning company's CEO, Harald Wack, reflects on the inspirations of his father and Zestron founder Oskar Wack.
by Mike Buetow

FIRST PERSON

• CAVEAT LECTOR
  Big problems.
  Mike Buetow

MONEY MATTERS

• ROI
  What the P in IP really stands for.
  Peter Bigelow
  

• FOCUS ON BUSINESS
  What Foxconn’s Wisconsin deal really means.
  Susan Mucha

TECH TALK

• SCREEN PRINTING
  Printing with water-soluble pastes.
  Clive Ashmore
• TECH TIPS
  The right tool, used wrong.
  Timothy O’Neill
• DEFECTS DATABASE
  “Unapeeling.”
  Martin Wickham