Sentry SMT pick-and-place on-board vision system has two modules: SIM and EPV. SIM (strobed inspection module) AOI system ensures no misplaced boards will be sent to the oven. EPV module (embedded process verification) evaluates errors detected by the SIM module. Process is recorded photographically in real time. SIM system consists of several single modules within the line, including high-speed focus cameras with integrated stroboscopic illumination. A master template of the assembled board to be produced is stored by the software. Board is scanned after screen printing to obtain master image, including 2- or 3-D paste inspection. Subsequent scan occurs between chip and IC assembly, then image is laid over master template and compared. SIM checks exact position of components on solder paste; component presence, tombstones, polarity, and dropped components. Requires no programming. EPV can be used as a standalone module or with SIM.

Juki, www.jas-smt.com