Products
X-Plane x-ray inspection system views individual 2D slices within a sample from top-to-bottom, front-to-back, left-to-right, and any plane in between. Can use anywhere in an 18" x 16" inspection area. No need to cut or destroy the board. Works at high magnifications. Available on Diamond FP, Diamond, Ruby FP, and Ruby x-ray systems. Shows position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc.; identifies Head in Pillow and open joints; inspects different layers within package on package or MCM; identifies tilted components and board warpage.
Nordson Dage, www.nordsondage.com
X-Plane x-ray inspection system views individual 2D slices within a sample from top-to-bottom, front-to-back, left-to-right, and any plane in between. Can use anywhere in an 18" x 16" inspection area. No need to cut or destroy the board. Works at high magnifications. Available on Diamond FP, Diamond, Ruby FP, and Ruby x-ray systems. Shows position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc.; identifies Head in Pillow and open joints; inspects different layers within package on package or MCM; identifies tilted components and board warpage.
Nordson Dage, www.nordsondage.com
MUNICH – Initial thoughts from Productronica, where the weather was brisk outside, but starting to heat up inside.
Traffic was a bit slow relative to past years. The show itself seems smaller – and again, this is relative, as it remains bigger than almost all the other major electronics assembly trade shows combined – with traditional powerhouses like Siemens, Universal Instruments and other placement companies occupying booths that, while they would still qualify as monstrous at any other show, no longer fill entire halls on their own. (This is a good thing.)
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