Products
TR7550 SII inline AOI offers a dual-lane configuration and has a 64-bit operating environment; permits multi-core processing technology. Has expanded memory capacity. Image FOV has doubled in size, reducing the number of scans required and reportedly cutting inspection times in half. Linear motor and linear scale create a stable X-Y table motion system. Includes digital 3 CCD full-color camera at the top and four angle cameras; RGB 3-color LED color lighting system and multi-angle lighting control system. Inspection is suitable for Pb-free manufacturing and fine-pitch/01005 components. Repair station system has graphical interface. Provides SPC calculations and reports.
TRI, www.tri.com.tw
TR7550 SII inline AOI offers a dual-lane configuration and has a 64-bit operating environment; permits multi-core processing technology. Has expanded memory capacity. Image FOV has doubled in size, reducing the number of scans required and reportedly cutting inspection times in half. Linear motor and linear scale create a stable X-Y table motion system. Includes digital 3 CCD full-color camera at the top and four angle cameras; RGB 3-color LED color lighting system and multi-angle lighting control system. Inspection is suitable for Pb-free manufacturing and fine-pitch/01005 components. Repair station system has graphical interface. Provides SPC calculations and reports.
TRI, www.tri.com.tw
ESLE-10 one-part silver-loaded epoxy resin for conductive bonding offers mechanical bonds and electrical conductivity. Reportedly has excellent adhesion; can be used as a conductive bond between solder-free surface mount connections, solder repairs, static discharge and grounding or general conductive adhesions. Operating temperature is -30 to +130°C. Has an electrical resistivity value of <0.0005 ohm-cm.
ES501 underfill resin is said to improve adhesion strength of devices during mechanical stress. Reportedly does not compromise thermal cycle performance. Can be reworked, and used in high-volume assembly. Provides void-free underfill of area array devices; has snap-curable properties. Typical curing times of 35-40 min. at 90°C or 3 min. at 150°C.
Electrolube, www.electrolube.com
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