ATLANTA, GA ― January 4, 2017 ― Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced the shipment of its first warpage metrology system specifically designed for FOWLP Panel applications – the AKM600P – to a key customer in Asia.

Akrometrix has been supplying thermal warpage systems for more than 20 years utilizing the shadow moiré technique, and developed the ideal bridge tool for FOWLP applications – the AKM600P. This system is able to provide full FOV warpage metrology with a single captured image in less than 2 seconds for substrates from 50mm to 610 x 600 mm without any hardware changes.

Mayson Brooks, Akrometrix’s CEO, states, “The AKM600P is the perfect warpage metrology system for customers as they enter the highly anticipated FOWLP market. Its bridge capability from wafers to panels makes its return on investment very favorable, and optional DFP modules expand its capabilities to multiple applications beyond FOWLP.”

For more information about Akrometrix’s warpage metrology systems, please contact sales@akrometrix.com or visit www.akrometrix.com.