Somerset, NJ – May 11, 2017 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will host a full day seminar on “Low Temperature Assembly Technology” on May 18, 2017 in Crowne Plaza Hotel in Suzhou, China.

The free seminar from Alpha, a part of the MacDermid Performance Solutions group of business, focuses on the current hot topic “Low Temperature Soldering”.  Topics include “A History and Overview of Low Temperature Solder Alloys”, “A New Generation of Low Temperature Solder Alloys (HRL1)”, “iNEMI Collaborative Effort on Low Temperature Soldering”, “Low Temperature Soldering SMT Experiment” and also the newly coming soon to market “ALPHA® OM-550 HRL1 Solder Paste” will also be introduced at the seminar.

“ALPHA® OM-550 HRL1 represents the culmination of years of research and development, bringing SAC305-type mechanical and thermal reliability in a low temperature alloy to board level assemblies once thought impossible. ALPHA® OM-550 HRL1 meets reliability requirements typical of motherboard and mobile assemblies, and supports our customers’ endeavor to reduce their carbon footprint without impacting performance. We are therefore excited to bring together representatives of our industry who have taken the first step towards reaping the benefits of this game changing class of materials in an event to share and showcase the results of their efforts at the Crowne Plaza Hotel in Suzhou”, said Phua Teo Leng, Regional Product Manager of Solder Paste.   Alpha has had a long-standing history of being a leader in innovation and sustainability, and OM-550 HRL1 is yet another statement of Alpha’s commitment to the industry that we support the transition to a low carbon economy.

For more information on Alpha’s vast product offering and capabilities, visit AlphaAssembly.com