PICA Product Development (PPD), sister company of PICA Manufacturing Solutions (PMS) has acquired a new Mycronic MY600JX Solder Paste Jet Printer.

The system has been qualified and running production. The MY600JX jets both SnPb and SAC305 solder paste as well as over one hundred other high-tech materials.

PPD GM, Nick Harris commented: “Eliminating solder paste stencils, enhances our Lean efforts and our Sustainability model. It has taken our changeover time for solder paste application from 10-15 minutes to 10-15 seconds.” Richard Shevelow, CEO of PICA stated: “This innovative technology provides us with flexibility and quality advantages in the production of PPD’s OEM PCB assemblies. It also furthers our technical capability to produce flexible printed circuit assemblies for the Customers of PMS. The ability to use vision technology along with on the fly scaling for solder paste application is quite useful in the production of flexible printed circuit assemblies.”

About PICA Manufacturing Solutions: A North American based team of electronic interconnect professionals with extensive experience in global manufacturing, materials, engineering, and technology development. Our mission is to help our Customers succeed in their efforts to bring innovative – sustainable products to market in an accelerated and cost effective manner. We do this by applying our extensive engineering and manufacturing experience with flexible printed circuits and assemblies.