July 3rd, 2017 ― Cranston, Rhode Island USA - AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that it will host a Knowledge Sharing Session in Guadalajara, Mexico¸ on July 12th, 2017.

AIM’s International Technical Support Director, Carlos Tafoya, will present the white paper “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction.”

Carlos will present the white paper “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction.” Many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. Carlos’ presentation will highlight a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.

This free seminar, hosted by AIM, SmartSol Technologies and Reymet, will be held at SmartSol Technologies in Guadalajara, Mexico. This Knowledge Sharing Session will consist of four conferences, with speakers from AIM, KYZEN, Nordson Matrix and ASM Technologies, covering topics from void reduction to cleaning a no-clean flux. For more information about this event, please contact Barbara Soto at bsoto@aimsolder.com.

To register, please visit: http://conta.cc/2tqsnhe

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