Somerset, NJ – September 28, 2017- Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be exhibiting and giving a featured presentation at the 2017 SMTA Mexico Conference and Exhibition on October 18 – 19 at the Hotel Riu Plaza, Guadalajara, Mexico.

At the show, Alpha will feature its latest void reduction and low temperature assembly process technology solutions. Two products to be highlighted during the show as part of these solutions are the innovative void reduction ALPHA® AccuFlux™ BTC-578 Preform System and a new low temperature solder paste, ALPHA® OM-550.

“Alpha has developed a reliable low void technology system for bottom terminated components.“ Said Jerry Sidone, Product Manager for Engineered Materials at Alpha Assembly Solutions. “The ALPHA® AccuFlux™ BTC-578 Preform System has been specially designed to dramatically decrease voiding, an issue of increasing importance as power densities continue to rise and managing thermal reliability becomes more of a challenge.“

Alpha recently launched its new ALPHA® OM-550 low temperature solder paste. “We are very excited about the performance of OM-550. It is a low temperature solution for customers looking for SAC305-type mechanical and thermal reliability in a low temperature alloy,“ said Robert Wallace, Regional Marketing Manager for the Americas. “This paste provides customers with efficiencies in both energy and cost while improving BGA mechanical reliability compared to other low temp alloys.“

In addition, Alpha will deliver one of the featured presentations during the conference. Mitch Holtzer, Director of Alpha’s Reclaim Business, will be presenting, “The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance“ on Wednesday. October 18, Salon B.