A group of providers of lead-free soldering and assembly will put on a full day of seminar presentations at the Hilton Hotel, Nuremberg, Germany on June16, 2004. The event has been planned close to the nearby SMT Exhibition to allow manufacturing management the opportunity to attend both events.

 

A representative from Indium Corp. (Utica, NY) and Vahid Goudarzi of Motorola will explain how Motorola implemented lead-free solder in the production of over 10 million cellular phones. The discussion will also cover initial quality and product implementation.

 

Dr. Ning Cheng Lee and Dr. Ronald Lasky of Indium will also cover topics such as alloy selection and challenges and best practices of implementing lead-free assembly.

 

A number of other presentations include Hewlett Packard's discussion on implementation onto large boards. Gerjan Diepstraten, Vitronics- Soltec, will discuss lead-free wave soldering and Hans-Juergen Albrecht, Siemens, will cover reliability of lead-free interconnects. Ross Bernston, Indium, will cover the subject of mixed technology in lead-free assembly.

 

ACB, Peters and KIC will give other presentations. The event is by reservation only.

 

www.indium.com/quickstart

 

Copyright 2004, UP Media Group. All rights reserved.


Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account