DEK (San Jose, CA), a high accuracy mass imaging solutions provider, has taken electroform stencils to the next level by incorporating an exclusive, sophisticated aperture height control method to their production of Eform stencils.

The stencils incorporate provide superior performance and ensure seal contact to the pad, pad paste deposit and a greater percentage volume of paste on pad. The reactive force created by the stencils provides for an even distribution of paste and allows for a more clean release of paste from the aperture. This technology also delivers ultimate control over stencil thickness and uniformity, ensuring paste volume consistency for fine pitch applications. The stencils also improve solder paste release for some of the more challenging lead-free solder paste formulations.

When the stencil process is combined with the new variable aperture height technology (VAHT), it becomes even more powerful.

Richard Tang, DEK global Eform manager, said, "Board co-planarity issues are a prevalent problem. The uneven resist layer causes a poor seal between the board and the stencil, which can result in printing problems. DEK has that problem solved. Our VAHT, an inherent characteristic of DEK's Eform stencils, adjusts for the variances in resist layer heights and provides a uniform seal across the entire board."

DEK's Eform process and inherent VAHT produce stencils that will enable technology for next-generation fine-pitch surface-mount and semiconductor packaging technologies. As the lines between complex surface-mount assembly and semiconductor packaging processes continue to blur, the need for advanced stencil technology becomes even more apparent.

www.dek.com

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