Universal Instruments Corp. (UIC, Binghamton, NY) announced recently that it has established requisites for a long-term partnership with Shanghai, China-based DaimlerChryslerSIM Technology (DCSIM Tech.). DCSIM Tech. is a joint venture between DaimlerChrysler and Shanghai Institute of Microsystem and Information Technology.

According to UIC, the objective is to build local expertise in advanced electronics packaging. The two companies will invest in China's future in these technologies by training engineers, working with local suppliers, increasing local infrastructure and supporting local company projects for first- and second-level packaging.

"Our vision is to build an industry capable of servicing local Chinese component manufacturers and assemblers as well as export markets throughout Asia and worldwide," said Richard Boulanger of UIC's SMT Laboratory. "Both businesses will invest substantial resources to nurture local technical expertise and enhance the local infrastructure in Shanghai and Suzhou."

"Both companies are well positioned to develop China's high-tech electronics industry," stated Dr. Xiaoming Xie of DCSIM Tech. "As one of the major players on the local market for many years, I am pleased that this agreement has established long term objectives, as a high level of ongoing commitment is the only truly effective way to establish China as a global center of excellence."

Under the draft terms, UIC—with laboratories in Binghamton and Suzhou, China—will also help sponsor a student from DCSIM Tech. to join the electronics packaging program at Binghamton University. DCSIM Tech. will offer students and other resources such as failure analysis and reliability testing for specific Universal projects.

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