Indium Corp. (Utica, NY) has announced the release of a new Product Data Sheet entitled: Eutectic Gold/Tin Solder. It is available immediately as document number 97800.

Eutectic AuSn solder alloy finds use in critical applications such as high-reliability medical, aerospace and military applications; die-attach and lid sealing; or as a braze alternative. The solder's relatively high melting point and joint strength make the alloy useful for certain applications.

The document provides detailed physical properties of eutectic AuSn solder alloys and discusses applications and characteristics of the material. Performance of the solder, and the resultant solder joint, are also covered.

Indium is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials.

Contact Indium Corp. to obtain a copy of the product data sheet and to discuss your application.

www.indium.com

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