IPC (Northbrook, IL) has announced the collection of free events planned for its co-located IPC SMEMA Council's APEX/IPC Printed Circuits Expo/IPC Designers Summit exhibition and conference, being held Feb. 24-26, 2004, at the Anaheim Convention Center, in Anaheim, CA.

In addition to the complimentary keynote addresses of Solectron president and chief executive officer Michael Cannon, industry forecaster Walt Custer and the multi-talented Bill Nye-The Science Guy, the trade show will feature eight free forums throughout the exhibition and conference. The schedule includes:

1) Beyond Lead Free-WEEE/ROHS on Feb. 24
Chair: Fern Abrams, IPC
This panel discussion will provide insights into what leading companies are doing to prepare for the July 2006 lead-free compliance deadlines along with the latest developments in legislation, exemptions and definitions of lead free under Waste Electrical and Electronic Equipment (WEEE) and Restriction on Hazardous Substances (RoHS). Additionally, the panel of experts will examine the ripple effects of this legislation on laws and regulations in the U.S. and abroad.

2) North America or Asia: Where is the Best Place for Your Manufacturing? on Feb. 25
Chair: Lisa Hamburg, Circuits Assembly magazine
The relative complexity, quantity required, circuit density, level of customization needed and delivery time frame are just a few of the issues that help determine the supply source. This panel discussion will discuss and debate the various pros and cons of overseas sources.

3) IPC PCQR2 Database-Globally Accepted de facto Standard for Comparing Process Capability, Quality and Relative Reliability of PCB Suppliers on Feb. 24
Chair: David Wolf, CAT, Inc.
The IPC D-36 Subcommittee has developed an industry standard, IPC-9151A, for process capability test panel designs and the PCQR2 database detailing the capabilities of printed circuit board (PCB) suppliers. The database provides quantitative data that allows subscribers to statistically benchmark board suppliers' capabilities; perform intelligent sourcing; select new suppliers; ensure design for manufacturability; and establish realistic design rules. The seminar will include in-depth discussions on the test panel designs, analysis reports and the capabilities of the PCB supply chain documented in the database.

4) Domestic PCB Technology Innovations at the U.S. Naval Surface Warfare Center, Crane Division on Feb. 26
Chair: Bill Payne, EG&G Crane Operations
The Emerging Critical Interconnect Technology (ECIT) program was created to co-opt military, academic and industrial extension for the purpose of facilitating North American research and development consistent with IPC's technology roadmap. This presentation will provide insight into ongoing ECIT projects, their goals, status, the participants and potential delivery schedules.

5) NEMI Defective Parts per Million Opportunities (DPMO) Project Forum on Feb. 25
Chairs: Tim Kruse, Plexus NPI Plus, and David Mendez, Solectron Texas LP
The NEMI DPMO project team is nearing completion of an investigation into package-level DPMO rates throughout the electronics assembly industry. Such DPMO data can be used to quantify the expected fault spectrum on a particular PCB assembly, enabling manufacturers to more accurately assess the cost of assembly, test, repair and scrap and also estimate the shipped product quality level of a product. Participants in the NEMI DPMO Project Team will present findings from the study, share the lessons learned and discuss the vision for follow-up on DPMO efforts in the industry.

6) Will the Real Immersion Silver Please Stand Up? on Feb. 24
Chairs: Kim Hyland and Dave Mendez, Solectron
As consumers demand more cutting-edge electronic devices, as original equipment manufacturers (OEMs) design higher functioning boards and as chemical companies make new PCB surface finishes, fabricators and assemblers need to endure the fast progression of all these changes. In this session, representatives from fabrication, assembly, OEM and chemical supply companies will answer all questions and concerns relating to the implementation of immersion silver.

7) Reactivation of IPC's OEM Council on Feb. 25
Chair: Daryl Sato, Intel Corp.
IPC is reactivating its OEM Council, which has made significant contributions to efficiency in the supply chain through development and release of standardized vendor surveys. The council's mission is to develop and use a methodology for PCB technology and assessment and advancement, evaluate PCB supplier process capabilities, identify technology gaps and monitor R&D advancements and PCB design changes to ensure gap closure. The panel will discuss their working group efforts and solicit feedback on ways to integrate and expand such collaborative projects through the OEM Council.

8) International Technology Interchange-Total Packaging Solution Roadmap on Feb. 24
Chair: Dieter Bergman, IPC
This forum will discuss global industry needs and how international organizations are involved in developing common ways of understanding future development and improving the international supply chain. The panelists will cover various topics, ranging from the definition of Jisso to the hierarchy of electronic packaging to optoelectronics and a global outlook on lead and halogen free.

For more information about these events, visit http://shows.ipc.org or contact Joe Dudeck, IPC communications manager, JoeDudeck@ipc.org.

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