Somerset, NJ – April 5, 2018 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present a technical paper on “Low Temperature Soldering Using Sn-Bi Alloys” at the upcoming SMTA China South Technical Conference on April 25, 2018 in Shanghai.

Presented by William Yu, Senior Technical Services Manager for Alpha, the paper illustrates how low temperature solder alloys are preferred for the assembly of temperature-sensitive components and substrates. The alloys in this category are required to reflow between 170°C and 200°C soldering temperatures. Lower soldering temperatures result in lower thermal stresses and defects, such as warping during assembly, and permit use of lower cost substrates. Sn-Bi alloys have lower melting temperatures, but some of its performance drawbacks can be seen as deterrent for its use in electronics devices.

Therefore, the technical presentation will show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics industry specific needs. The physical properties and drop shock performance of various alloys will be evaluated, and their results will be analysed in terms of the alloy composition, including Bi content and alloying additions.

To learn more about Alpha Assembly Solutions’ vast product offering and capabilities, please visit Alpha website.

SMTA China East Technical Conference
Date:                 Wednesday, April 25, 2018
Time:                 10:30am -11:05am
Venue:              Room No. 6, B2, Shanghai World Expo Exhibition & Convention Centre
Topic:                Low Temperature Soldering Using Sn-Bi Alloys
Presented by:  William Yu, Senior Technical Services Manager of Alpha Assembly Solutions