Somerset, NJ – December 7th, 2018 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, joined MacDermid Enthone at the 2018 International Printed Circuit & APEX South China Fair, Booth#6H31, Shenzhen, China, December 5-7, 2018.

At the show, Alpha, a part of the MacDermid Performance Solutions group of businesses, exhibited low-temperature solder which allows the customers to learn more about how low-temperature alloys can help reduce power consumption and carbon emissions in the manufacturing process. Low-temperature product technology has ability to increase production yields, reduce component warpage and also reduce board warpage.

In addition, Alpha exhibited die attach solutions which improve reliability and device performance for automotive, alternative energy, transportation, consumer electronics, telecommunications and industrial applications. Alpha’s Argomax® Sinter Technology is well developed to meet and even exceed the demanding quality standards of the power semiconductor industry.

MacDermid Enthone’s circuit board expertise focused this year on enabling technology trends such as the cost savings and miniaturization of MSAP and high frequency. At the show, they featured the fully expanded MacuSpec acid copper metallization portfolio, and the high performance Systek brand of specialty metallizations for IC substrates.

Both Alpha and MacDermid Enthone experts were available to discuss the latest chemical and material solutions providing process predictability and smooth scale-up at every step. These technologies are part of a suite of processing solutions that serve the electronics manufacturing supply chain at every step, from device design, through circuit board production, semiconductor metallization, component assembly, and OEM specification.

To learn more about Alpha’s Low-Temperature Alloys or Die Attach Solutions, please visit the Alpha website.

About Alpha Assembly Solutions

Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.

As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges. Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services. For more information, visit AlphaAssembly.com.

About MacDermid Enthone Electronics Solutions

MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us at: macdermidenthone.com/electronics

Alpha将在2018国际线路板及电子组装华南展览会上 展示低温焊接和固晶解决方案

2018年12月6日 – 全球领先的电子焊接及接合材料供应商爱法组装材料(Alpha Assembly Solutions)，参与我们的姊妹公司MacDermid Enthon在 2018年12月5-7日于中国深圳举办的国际线路板及电子组装华南展览会，展位号：#6H31。 棣属于麦德美性能解决方案公司的Alpha，在展会中展示低温焊料，让客户得知如何使用低温合金在生产过程中降低功耗和碳排放。低温焊接技术能够提高产量、减少元件及线路板翘曲。 此外，Alpha 也展示了固晶方案，为汽车、替代能源、运输、消费电子、电信和工业应用的客户改进固晶可靠性及设备性能。Alpha的 Argomax® 银烧结技术满足甚至超过功率半导体行业苛刻的质量标准。

MacDermid Enthone的线路板专家今年将重点关注支持技术发展趋势，如MSAP的成本节约和微型化。在展会中他们会展示已全面拓展的MacuSpec酸性电镀铜金属化系列产品及高性能Systek IC载板专用金属化工艺。

Alpha及MacDermid Enthone的专家将在展位#6H31中讨论最新的化学和材料解决方案，帮助实现每一步工艺的可预测性和使每个步骤产能都能稳步提升。这些技术是一系列工艺解决方案的关键部分，而且涉及了电子制造供应链的各个工艺步骤，从电子元器件设计到印刷电路板生产、半导体金属化、元器件组装及OEM技术规范。欢迎到6H31展位了解更多详情。 更多关于Alpha低温合金或者固晶方案的资料，请浏览Alpha 网页.

关于爱法组装材料

爱法组装材料棣属于麦德美性能解决方案公司。专门研发、製造及销售用于电子组装、固晶及半导体封装的专业创新材料，实力领导全球。其产品涵盖各大行业领域，包括汽车、通讯、电脑、消费级电子、电力电子、LED 照明、光伏等。

随着电子行业的不断发展，爱法组装材料专注于开发新颖独特的组装工艺以应对挑战。无论是传统电子组装、固晶还是新兴应用（例如柔性、可成型电子产品），爱法组装材料都会为其生产工艺设计解决方案。研究多个产品如何在同一环境中进行交互，从而为客户提供最有效的组装解决方案。

自1872年成立以来，爱法组装材料一直致力研发及生產最高品质的专业材料，并且专注其可持续性发展及回收应用。如欲取得更多资讯，欢迎瀏览AlphaAssembly.cn

关于 MEES

麦德美乐思电子部MacDermid Enthone Electronics Solutions (简称MEES) 是研究，配制和提供应用于先进电子产品中的特用化学品。我们提供的产品和技术服务方案满足如今最为复杂的线路制造需求。MEES 是 MacDermid Performance Solutions (简称MPS) 旗下的电子事业部。从无线、汽车到军用电子产品 - 你所能见到的，以及很多看不到的电子产品中，都有MacDermid Enthone的身影。欢迎访问我们的网站: macdermidenthone.com/electronics。