Irvine California, USA – TopLine Corporation will exhibit its innovative CCGA - Column Grid Array – IC packages at the West Coast's 2019 Space Tech Expo show May 21-22 in Pasadena, California, USA. Space Tech Expo USA is America’s engineering and manufacturing meeting place for space technology. The show will be held at the Pasadena Convention Center, 300 E. Green St., Pasadena, CA 91101.

TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. They reduce stress caused by CTE mismatch, increasing the reliability of semiconductor components for space, mil/aero, down-hole drilling and special automotive and medical applications. CCGA technology increases life for FPGA (Field programable Gate Arrays). CCGA are better than BGA for rugged operating environments.

For more information, visit www.Topline.tv/CCGA.html.

About TopLine

TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. Contact TopLine Corporation, Tel (800) 776-9888; Email: info@TopLine.tv.