3M Wafer Support System for ultra-thin semiconductor wafer backgrinding is an alternative to conventional tape processes and is capable of producing wafers as thin as 20 microns. Permits manufacturers to use existing grinding equipment to produce thinner wafers, at faster grinding speeds, with increased yields. Includes both equipment and consumables for a comprehensive approach to wafer backgrinding support challenges.

Features include: 

• A wafer mounter to attach the wafer to the glass plate with liquid adhesive.
• A wafer demounter to separate the glass and adhesive from the wafer after the backgrinding process. 
• A glass cleaner/coater.

Consumable materials include 3M ultra-clean UV curable spin-on adhesive and a light-to-heat conversion coating. The LTHC layer enables separation of the adhesive from the glass after the backgrinding process.

Unlike tapes used in other systems, the liquid adhesive used in the 3M system flows into the topography of the wafer, providing even support over the entire surface and providing a rigid, uniform base. The system minimizes stress put on the wafer, resulting in less cracking and increased yields.

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