Pyramax 98 solder reflow oven is now equipped with an integrated flux coating and wafer handling system for wafer bump reflow. The coating system can handle 200 or 300 mm wafers and is configured with an integrated robotic wafer handler.

At the oven's back-end, an automated unloading station completes the integrated wafer handling process.

Features forced impingement technology for temperature uniformity and an optional closed-loop convection control for constant heat transfer and cooling rates. Provides atmosphere purity below 5ppm and reportedly has the industry's lowest nitrogen consumption.

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