Anza RFID now offers ultra thin (085µm), small footprint (2 x 5 mm) RFID modules with optimized reliability. The planarized semiconductor package, MicroSite, offers product integrity for RFID devices in all frequencies. Custom design of RFID transponders for demanding environmental, medical and military applications is available in quantities of 100 to 100 million pieces.

The enhanced ultra sonic die bonding technology increases integration of fused metallurgy at the bond site. Several advanced methods for attaching the chip module to the antenna have created added flexibility for employing a MicroSite module to etched, printed or discreet wire antennae. 

Intraglobal.net distributes RFID products through Anza RFID, a division of Special Equipment Engineering Inc.; www.anzatech.com.