Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced plans to exhibit in Booth #516 at SMTA International, scheduled to take place Sept. 24-25, 2019 at the Stephens Convention Center in Rosemont, IL. The company will display the new FOX² by that combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.

FOX² has a machine footprint of just under 11 sq. ft and can accept PCB sizes up to 16 x 12". Components with sizes from 01005 up to 1.3 x 3.1"are placed. The machine achieves 10,800 cph (IPC9850) at 50 µm, 3 sigma with a two nozzle head.

The Two head version is our best seller based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small-medium production environments. The machine achieves 10,800 cph (IPC9850) at 50 µm, 3 sigma with a two nozzle head.

Essemtec’s FOX² can be fitted with a Jet valve for SMD glue or solder paste for hassle-free manufacturing of 2.5D assemblies or lower cost micro screw valve. Fox2 also features our award-winning software ePlace found on all platforms.

For more information, contact Steve Pollock at 856-218-1131 (desk), 856-524-1110 (mobile) or sales@essemtec-usa.com. To view the latest information and videos visit www.essemtec-usa.com.

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