October 2nd, 2019 ― Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation at the SMT – Info International Conference scheduled to take place on October 15-16, 2019 at the Brno University of Technology in Brno, Czech Republic.

Petr Bettinec will present the paper “Solder Process Optimization Using New AIM Alloys: Comparison to Common Lead-Free Alloys in Use (Case Studies).” As the alloy options available to PCB assemblers continue to grow, a deeper understanding of the performance attributes is gained.  In this presentation, AIM engineers have collected data from three field trials of new second generation alloys offering higher reliability and ease of use when compared to first generation lead-free materials.

AIM will also highlight its full line of advanced solder materials, including its award-winning REL61 and REL22 high reliability alloys and new cored wire solders, RX18 and CX18. To discover all of AIM’s products and services, visit the company at the SMT – Info International Conference in Brno, Czech Republic for more information and to speak with one of AIM’s knowledgeable staff members.

About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit www.aimsolder.com.