SN100C P810 D4 is designed for use in vacuum reflow with nitrogen. Is a high-reliability no-clean Pb-free solder paste optimized to deliver excellent reflow characteristics; generally can be reflowed with a profile similar to that commonly used with SAC 305 and SAC 405 with 240°C peak. Reduces voiding to less than 1% in measured void area. Has excellent wetting behavior. Is a compliant alloy that provides high-impact strength.

Nihon Superior, www.nihonsuperior.co.jp/english