MARKET DYNAMICS:

Market trends:

Top OSATs saw 15-20% increase in 2020 revenue compare to 2019 and 2021 is expected to shape up as a “Banner Year” for OSATs.

Total advanced packaging revenue is expected to grow at 7.9% CAGR between 2020 and 2026.

5G, automotive infotainment/ADAS, AI, Datacenter and wearable application megatrends continue to thrive the semiconductor eco-system.

Special focus: FCCSP packaging

This market segment will reach more than US$10 billion in 2026.

Those packaging solutions are mainly used for baseband, RF transceivers, memory, and some PMIC applications.

FCCSP packaging market share is controlled mainlyby top OSATs such as ASE, Amkor, JCET, and memory suppliers such as Samsung, SK Hynix, and Micron.

To download market figures & trends, click Advanced Packaging Quarterly Market Monitor

Yole’s Advanced Packaging Monitor is published every beginning of March (Q1), June(Q2), September (Q3) and December (Q4)... Aim of these services is to provide an in-depth coverage of rapidly changing market dynamics and main players’ status and strategy.

Module I: Fan-Out Package Monitor – Wafer & Panel level
Module II: WLCSP / Fan-In Package Monitor
Module III: 2.5D/3D Stacked Package
Module IV: FCBGA Package
Module V: FCCSP Package (2021 Q1) NEW

In addition, the market research and strategy consulting company Yole releases dedicated advanced packaging reports:

5G Packaging Trends for Smartphones
WLCSP/ Fan-In PackagingTechnologies and Market
High-End Performance Packaging: 3D/2.5D Integration 2020
Status of the Advanced Packaging Industry

Stay tuned to i-Micronews to get further information about our Advanced Packaging, Semiconductor Manufacturing & Memory activities!