(South Plainfield, NJ USA) – May 4, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.

ALPHA Argomax AccuLam is the next revolution in Sintering Film, delivering higher throughput and larger area lamination compatibility whilst being uniquely customized for a customer’s requirements. The film is part of the range of ALPHA Argomax Sinter Process Solutions which also includes paste for printing and dispense and preforms specially engineered for Top Side Attach, Die Attach, Wafer Attach and Package Attach processes.

A key highlight at the MacDermid Alpha booth will be demonstrations of ALPHA Argomax in the package attach process using a sintering press. The successful sintering of molded power packages is possible due to the lower pressure, lower temperature, and faster sinter times enabled by ALPHA Argomax. The paste ensures intimate contact between the package and the heat-sink, accommodates warpage, and sinters with low pressure without cracking the molded module. ALPHA Argomax, based on proprietary nano-particles technology, is the preferred sintering solution for package to heat-sink attach with demonstrated 10X improvement in power cycling reliability.

To register for PCIM Europe please visit: https://pcim.mesago.com/nuernberg/en.html

For more information on ALPHA Argomax AccuLam and the ALPHA Argomax range of Sintering Process Solutions please visit: macdermidalpha.com

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Assembly Solutions, Semiconductor Solutions, and Circuitry Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.