CLINTON, NY — Indium Corporation’s expertise and proven products were featured at NSW Automation’s launch of its N4 Full-Range Solder Paste Micro-Dispenser during a special event in Penang, Malaysia.

Indium Corporation’s proven solder paste for jetting and microdispensing applications — Indium12.8HF — was featured in several demonstration machines at the event.

Indium12.8HF is a no-clean, halogen-free solder paste optimized for long-term jetting and microdispense applications. Indium12.8HF has proven to be useful in a wide range of applications requiring precision dot diameter/line width deposits down to 80μm, consistently achievable with NSW’s equipment.

Additionally, Indium12.8HF:

• Meets IPC J-STD-004B with Amendment 1 ROL0 requirements
• Offers exceptional electrical reliability
• Minimizes graping and similar reflow issues with a unique flux oxidation barrier formulation
• Delivers aesthetically pleasing clear residue with minimal flow-out
• Provides minimal reflow spatter compared to similar solder pastes
• Long working (syringe) life

Other Indium Corporation products were featured at the event, including the award-winning Durafuse™ LT, a low-temperature alloy technology, and its GalliTHERM™ portfolio of gallium-based liquid metal solutions, a new thermal interface materials (TIMs) product line that can be applied with jetting and microdispensing equipment for mass production.

Additionally, Associate Director for Global Technical Service & Application Engineering Jonas Sjoberg shared his technical expertise and insight on the importance of design for excellence and collaboration.

To learn more about Indium Corporation's jetting and microdispensing pastes, visit www.indium.com/jetting-paste