Irvine, California, USA - TopLine® Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 15 – 18, 2022, in Booth B4-332. The exhibit will include leading TopLine products including CCGA Solder Columns, IC Bonding Wire, Zero Ohm Jumpers, IC JEDEC Trays, and more. TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling, and practice. For more information, visit Booth B4-332 at Electronica.

TopLine recently announced the availability of new low-void CCGA solder columns, developed by TopLine engineers using new proprietary processes. The absence of voids in the column's high temperature core makes the columns structurally stronger and more reliable.

About TopLine

TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. To learn more, visit www.CCGA.tv or call (1+) 800 – 776-9888.