AUSTIN, TX – TechSearch International’s latest analysis examines strategies for the adoption of chiplets and current products. While the market is small today in unit volume, a 103% CAGR is projected from 2022 to 2026. Challenges, including design and test, are discussed.

The report includes OSAT financials and examines economic trends impacting the industry. The North American OSAT market is examined with a focus on advanced packaging capability. Future plans for North American OSATs are discussed. The report also highlights packaging and assembly in Mexico. TechSearch International analyzes the supply and demand for build-up substrates used for flip chip BGAs. The sharp decline in the PC and other markets have lowered demand and the industry has excess capacity. Some unused capacity is being released this year and a few substrate makers are slowing capacity expansion. Substrate companies are facing price pressure, creating an unhealthy condition for the industry.

The latest Advanced Packaging Update is a 47-page report with full references and an accompanying set of more than 40 PowerPoint slides. View the report at https://www.techsearchinc.com/