NUREMBERG – True to its motto "Driving manufacturing forward", the SMTconnect taking place from 9 – 11 May in Nuremberg, Germany, will offer the European electronic production community a forum for inspiration and exchange as a basis for the further development of key technologies for the future.

Two months before the exhibition will open its doors, numerous well- known key players in the industry, including ASYS, Ersa, Essemtec, FUJI, JUKI, Panasonic, SMT Wertheim and Viscom, have confirmed their participation as exhibitors. They will present products and solutions from all areas of electronics manufacturing at the Nuremberg exhibition grounds, and exchange ideas on current industry issues such as increased energy costs, component and raw material shortages and obsolescence management, as well as the current re-shoring trend to Europe with peers and practitioners.

Highlights of the event once again include IPC’s hand soldering competition for young professionals as well as the Future Packaging production line presented by Fraunhofer IZM, this year on the topic of "Trust the Line" - Competitiveness through Trust, Sustainable Tool and Supply Chain.

The topic of supply chains will also be addressed at the "EMS Park" special showcase area. Offering impulse and best practice presentations (e.g. from Uhlmann & Zacher on the topic of EMS selection, specification creation and collaboration), this will highlight the benefits of close collaboration between EMS providers and OEMs for both sides and provide a platform for personal exchange that builds trust to delegate development issues and optimize the supply chain. Among other EMS companies, Assel, Elhurt and Coronex are participating, presentation topics include “The power of trust and dedication – Elhurt EMS way of navigating through components shortage reality” (Elhurt) as well as a number of relevant German-language contributions.

Furthermore, the "PCB meets Components" joint booth enjoys a high level of participation, with Würth Elektronik among the exhibiting companies.

With contributions on current topics such as "Operating AI use cases integrated into electronics manufacturing lines" (Dr. Sebastian Mehl, Siemens AG) on May 10 and the topics "Promoting young talent" and "Women in mechanical engineering - change in the company" on May 11, the trade fair forum promises an exciting program. This year, in addition to the ZVEI and Fraunhofer IZM, the VDMA and the German Association for Electronics Design & Manufacturing, FED e.V., are also participating, each with several program items.

Further information on the exhibition, topics and exhibiting companies is available at smtconnect.com. Interested parties are encouraged to purchase their tickets in advance via the event website.