OXFORD, CT – MIRTEC, ‘The Global Leader in Inspection Technology,’ will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.

MIRTEC’s Award-Winning MV-6 OMNI 3D AOI Series features its exclusive OMNI-VISION ® 3D Inspection Technology which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC’s revolutionary 12 Projection BLUE Moiré 3D Technology in a cost-effective platform. MIRTEC’s proprietary Ultra-High resolution CoaXPress Vision System is designed and manufactured by MIRTEC for use with its complete product range of 3D inspection systems. MIRTEC’s 12 Projection Digital BLUE Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured MIRTEC’s MV-6 OMNI machines feature four 10MP or 18MP Side-View Cameras in addition to the Top-Down Camera, a Multi-Focus Programmable Z-Axis System, an Internal PCB Flipper Conveyor, and Multi-Function AOI/SPI Fusion Technology.

MIRTEC’s Award-Winning MV-3 OMNI Desktop 3D AOI Series features the same hardware and software as MIRTEC’s in-line OMNI-VISION ® 3D Inspection Systems providing 100% compatibility across the company’s entire 3D AOI product line. These systems feature exclusive OMNI- VISION ® 3D Inspection Technology which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC’s revolutionary 12 Projection BLUE Moiré 3D Technology in a cost-effective platform. MIRTEC’s proprietary Ultra-High resolution CoaXPress Vision System is designed and manufactured by MIRTEC for use with its complete product range of 3D inspection systems. MIRTEC’s 12 Projection Digital BLUE Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured MIRTEC’s MV-3 OMNI machines feature four 10MP or 18MP Side-View Cameras in addition to the Top-Down Camera, a Multi-Focus Programmable Z-Axis System and Multi-Function AOI/SPI Fusion Technology. Without question, the MV-3 OMNI is the most Technologically Advanced Desktop 3D AOI machine.

AI Powered Smart Factory Automation Solution

MIRTEC’s Smart Factory Automation solution, ‘INTELLI- PRO’, is an AI based Software Suite specifically designed for the purpose of improving the performance and convenience of MIRTEC’s complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.

MIRTEC’s Award-Winning MS-11e 3D SPI Series features exclusive 15MP or 25MP CoaXPress Camera Technology, providing enhanced image quality, superior accuracy, and incredibly fast inspection rates. The MS-11e 3D SPI is also available with a cost-effective 4MP Camera Link option. These machines use Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient/excessive solder, shape deformity, shift of deposition and bridging. All MIRTEC 3D SPI machines are CFX complaint and feature upstream and downstream Closed Loop Feedback.

MIRTEC’s Award-Winning GENESYS-PIN Hybrid 3D AOI Series is specifically developed for the Automotive Electronics Market. This extraordinary system is configured with a 12 Megapixel CoaXPress High-speed Camera System, a 15um Precision Telecentric Lens, an advanced nine (9) Phase RGB Color Lighting System, a Programmable Multi-Focus Z-Axis System, and four (4) Programmable Multi-Pattern Digital Projectors which are an integral part of MIRTEC’s proprietary Hybrid 3D Measurement Technology. With this revolutionary optical system, the GENESYS- PIN machine can measure up to 50mm tall connector pins with extreme accuracy. The GENESYS-PIN machine detects defects such as missing pins, pin offset as well as measurement of distance between pins and inner/outer dimensions of forked pins.

New to SMTconnect 2023, MIRTEC will be displaying the GENESYS-CC AI Based Conformal Coating AOI Series. These revolutionary systems are configured with MIRTEC’s Exclusive 15MP CoaxPress Camera Technology, four 18MP Side-Angle Cameras and an optional Internal PCB Flipper Conveyor for Double Sided PCB Inspection. The GENESYS-CC machine inspects for Presence/Absence of Conformal Coating, AI Based Bubble Inspection and Lateral Side Component CC Inspection using the 18MP Side Cameras. The system is also fully capable of standard PCB inspection, providing maximum flexibility to the Electronics Manufacturing Environment.

MIRTEC is Leading the Way to Industry 4.0

MIRTEC’s Total Remote Management System (TRMS) is a fully integrated Industry 4.0 Solution which combines remote management with real-time data monitoring and analysis for each system within the SMT production line. MIRTEC’s TRMS provides real-time remote monitoring of status information and statistical data such as equipment operation status, production yield, PC resources, temperature, humidity, etc. The combination of MIRTEC’s 3D Inspection Systems and TRMS provide a vast improvement in production process management. The TRMS Module is a key part of MIRTEC’s Intelligent Factory Automation System, INTELLISYS ® . This powerful software suite was designed and developed by MIRTEC to provide manufacturers with a clear view into the manufacturing process, thereby helping them achieve higher operating efficiencies and improved quality.