CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 9-11, in Nuremberg, Germany.

Tuesday, May 9

• Materials for Low Warpage Power Module Assembly: Energy and C02 Reduction Through Low-Temperature Processes by Regional Technical Manager and Technologist – Advanced Applications Andreas Karch
  • • This presentation examines different material properties, such as CTE (coefficient of thermal expansion), which cause assembly difficulties at higher process temperatures. Lowering peak temperature during soldering counteracts this and saves additional energy.
    • The presentation will be given in German.

Wednesday, May 10

• Power Electronics Materials and Process Optimization by Product Manager – ESM/Power Electronics Joe Hertline
  • This presentation will analyze key power module packaging architectures and corresponding soldering, sintering, thermal interface, and assembly materials solutions that can increase product life, enable manufacturing scalability, and reduce cost of ownership.
• The Role of Sintering Materials Technology in EV Power Module Applications by Product Manager – Semiconductor Dean Payne
  • In this presentation, Dean will examine how sintering is used in die-attach and substrate-attach applications and how technological advancement of this material enables a more efficient manufacturing process in EV power module assembly.

Click here for additional information, including times and locations for all Indium Corporation presentations at PCIM. All presentations will be given in English unless otherwise noted.

Andreas provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to our customers in Europe.

Joe is responsible for driving the growth of Indium Corporation’s power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Joe also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).

Dean is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which includes high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #460.