CLINTON, NY – The upcoming SMTA China East Technical Conference will feature presentations by four Indium Corporation experts. The conference, which takes place July 19-20, is being held in conjunction with NEPCON China at the Shanghai World Expo Exhibition & Convention Center. In addition to presenting, Senior Area Technical Manager – East China Leo Hu will serve as Conference Chairman for the July 20 sessions.

Indium Corporation experts will share the following presentations:

• July 19
  • Fine Powder Investigation for Optimum Imperial 008004 SP Printing: Part I, presented by Area Technical Manager – East China Leon Rao, 10:45–11:20
  • Ultra-Low-Residue Flux Application in RF Front End Packaging, presented by Senior Area Technical Manager – East China Leo Hu, 14:55–15:30
• July 20
  • Ultrafine Solder Paste Dispensing for Heterogeneous Integration, presented by Area Technical Manager – East China Joey Qiao, 10:45–11:20
  • How to Solve LGA Voiding Through Process Optimization, presented by Senior Area Technical Manager – East China Leo Hu, 13:45–14:20

The SMTA China East Technical Conference, held in conjunction with NEPCON China 2023, will address the industry’s most pressing issues in Advanced Packaging/Components, Assembly Business/Supply Chain, Emerging Technologies, Harsh Environment Applications, PCB Technology, Process Control, and Soldering Processes.