IRVINE, CA – TopLine’s CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company’s exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.

For nearly 30 years, TopLine has been a developer and supplier of enabling technologies to international customers. These technologies have included (and still include) Bonding Wire for welding IC and Batteries, CCGA and BGA Solder Columns for military and aerospace, Daisy Chain Dummy components for testing PCB and assembly processes, JEDEC IC Chip Trays, Zero Ohm PCB Jumpers, PC Spacers, Flip Chips, Wafer Level Daisy Chain, and more.

In making the announcement, Martin Hart, CEO, stated, “We’re reaching out at the show to introduce our international customers to new products in the global market that we’re especially excited about; these include CCGA and our large BGA package solutions.”

TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.

Hart adds that “Currently, the largest Field Programmable Gate Array (FPGA) BGAs are 45mm x 45mm in size. But there is a movement trending to produce larger BGAs such as 50mm x 50mm and even 60mm x 60mm. But the ‘super-sized’ BGAs of 70x70mm to 100x100mm exhibit additional stress, resulting in warpage and other difficulties.” Hart adds that “Industry leading suppliers of semiconductor and infrastructure software products are beginning to produce ‘super giant’ BGA packages with multiple die inside that have accompanying stability issues. At TopLine, we maintain that these larger BGAs can benefit by using solder column technology instead of BGA solder balls. This is our solution to stress-related stability issues.”