LYON, FRANCE – Yole Group is part of Chiplet Summit 2024. The Summit occurs on February 6-8 at the Santa Clara Convention Center.

The Chiplet Summit program is now available HERE.

Chiplets improve chip yields and costs but still provide the performance of a large monolithic chip. Designers can mix and match chiplets, use the process technologies best suited to specific functions, take advantage of chiplet IP, and simplify moves to new process nodes, avoiding wafer waste and manufacturing defects. Chiplets are the key to producing the extremely high-density, high-performance chips required for today’s networking, storage, AI/ML, analytics, media processing, HPC, and virtual reality applications.

Chiplet Summit covers the latest architectures, development platforms, and applications. It includes pre-conference seminars, keynotes, annual updates, and paper and panel sessions. It covers all aspects of chiplet development, including design, interconnect, packaging, integration, and testing.

At Chiplet Summit 2024, Principal Analyst, Computing Tom Hackenberg and Technology & Cost Analyst, Computing Ying-Wu Liu from Yole Group present a “Market Research Update” in the leadoff plenary on “Chiplet Markets Are Rising: Where and When?”

In addition, Tom Hackenberg heads an expert panel on market research in the closing session which will discuss market trends in “Chiplets in 2028 and How We Got There” and provide a keynote for the Open Compute Platform Track. This panel discussion will be moderated by Bill Wong, Technology Editor for Electronic Design. In addition to Tom, panelists include John Shalf from Lawrence Berkeley Laboratory, Bapi Vinnakota from the Open Compute Project, and Jawad Nasrullah from Palo Alto Electron. More info.

Be sure to meet Yole Group’s computing analysts at Chiplet Summit 2024; book a meeting with them now: HERE.