CLINTON, NY – With more than five million electric vehicles (EVs) on the road with its materials and nearly a decade of experience in the market, Indium Corporation® is proud to feature its innovative Durafuse® solder technology alongside its Rel-ion™ portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, April 9-11, in Anaheim, California, U.S.

Among its featured products, Indium Corporation will showcase its lead-free Durafuse® technology and industry-proven Indium8.9HF solder paste series:

• Durafuse® HR – based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
• Award-winning Durafuse® LT – a novel solder paste alloy system with highly versatile characteristics that enable energy savings, high-reliability, low-temperature, step soldering, assemblies with large temperature gradients, and large BGAs with large complex warpage profiles. It also provides superior drop shock performance as compared to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
• Indium8.9HF Solder Paste Series – an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.

Some of the additional Rel-ion and high-reliability products for power electronics featured at IPC APEX will include:

• Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
• Award-winning InFORMS® – reinforced solder alloy fabrications which improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications.
• InTACK® – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
• QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput.
• Durafuse® HT – a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys.
• Heat-Spring® – a compressible, non-reflow metal TIM ideal for TIM2 applications.

To learn why Indium Corporation is trusted by top EV and power electronics manufacturers across the globe, visit our experts at booth 4227 or at www.indium.com