CLINTON, NY – Indium Corporation Junior Application Engineer Siegfried Lorenz will present as part of Delsys Tech Day on Wednesday, September 11, in Lucerne, Switzerland.

Lorenz will join nine other industry experts to share insights on forward-looking manufacturing trends within the electronics assembly sector. His presentation will showcase an innovative alloy system designed for high-reliability applications.

The presentation’s focus, Durafuse® HR, is a new high-reliability alloy used for solder paste, developed from the company’s Durafuse® mixed-alloy technology. It delivers enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications. Engineered to withstand 3,000+ thermal cycles at -40°C/125°C across different PCB finishes and component types, Durafuse® HR is ideal for applications requiring an extended mission profile beyond what is achievable with traditional Pb-free alloys.

“No longer does high-reliability have to mean high voiding, as Durafuse® HR outperforms SAC305 when it comes to bottom-terminated component voiding while also reducing solder joint cracking and increasing shear strength,” said Lorenz.

As a Junior Application Engineer, Lorenz supports Indium Corporation’s customers across Germany, Austria, and Switzerland, offering engineering guidance and technical specifications. He also accelerates the sales process by providing expert technical recommendations. Prior to joining Indium Corporation, Lorenz held positions as a senior mechanic, SMD operator, and head of SMD with major semiconductor manufacturers and electronic design firms. He holds a bachelor’s degree in electrical technology and management.