CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce its participation in the upcoming IPC APEX Conference and Expo, held at the Anaheim Convention Center in California from March 18-20, 2025. AIM will be showcasing its cutting-edge soldering materials, including Type 5 solder paste offerings, at booth #1902 on the exhibit floor.

In celebration of emerging trends in electronics miniaturization, AIM is declaring 2025 the “Year of Type 5”. With decades of experience producing high-quality solder pastes, including Types 4, 5, and 6, AIM is uniquely positioned to guide customers through the transition to finer powders. AIM products are developed with a focus on consistency, reliability, and process optimization, and are then coupled with robust technical support. While Type 5 solder paste won’t replace Type 4 as the industry standard this year, its adoption is accelerating, driven by demand for precise, consistent soldering.

Learn more about AIM’s declaration and its insights on Type 5 solder paste in the recently published blog post here.

In addition to exhibiting, AIM’s Gayle Towell will present the technical paper “Exploring the Feasibility and Challenges of a Low Temperature Alloy in Wave Soldering Applications” during conference session 17, which takes place on Wednesday, March 19, from 9:30–11:30 a.m. in room 303A.

With a commitment to providing innovative soldering solutions, AIM invites attendees to visit booth #1902 to learn more about its comprehensive product offerings and technical expertise. Don’t miss the opportunity to connect with AIM’s team of experts, who will be on hand to discuss Type 5 solder paste, low-temperature soldering, and other key industry advancements.