As one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at Productronica, taking place November 18-21, in Munich, Germany.

The company will showcase the following among its featured products:

Formic Acid Soldering Technology (FAST) products are designed for flux-free soldering, in particular, formic acid soldering. Product offerings include preforms, InFORMS®, and novel solder pastes, enabling high-reliability, flux-free soldering, ideal for efficient manufacturing of next-generation power electronics.

Durafuse® HR, a trusted and proven solder paste alloy technology, delivers enhanced thermal cycling capabilities (-40°C/125°C and -40°C/150°C) and superior voiding control for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.

Durafuse® LT is a solder paste alloy system engineered to decrease peak reflow temperature without compromising performance. It can reduce energy usage, improve reliability, and enable step soldering. It is ideal for assemblies with large temperature gradients and components prone to complex warpage during reflow. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and can outperform SAC305 under optimal process conditions.

InFORMS® reinforced solder preforms improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications. Three alloys—Indalloy®301LT, Indalloy®276, and Indalloy®314—will be featured.

Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.

InFORCE® Pressure Sinter Pastes are high-metal, low-organic content sinter materials available in both silver and copper. The benefits of a low-organic content composition include short drying for increased throughput and less volume reduction between wet and post-sintered deposits, meaning less paste can be used. The portfolio includes:

InFORCE®29 – a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.

InFORCE®MF – a proven pressure Ag sinter paste designed for SiC die-attach application and is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.

To learn more about Indium Corporation’s power electronics and solder solutions, visit www.indium.com or visit our experts at Productronica in Hall A4, Stand 309.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email kderuby@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.