Circuit Technology Center, Inc. announced the purchase of an additional reflow oven to support the company’s growing high-volume BGA reballing operations. The investment reinforces the company’s commitment to delivering fast turnaround times, consistent quality, and scalable solutions for customers requiring advanced PCB rework and component services.

This new Heller Model 1707MK7 - Ultra Low Power Consumption Reflow Oven will enhance production efficiency and increase throughput for BGA reballing projects across a wide range of industries, including aerospace, defense, medical, telecommunications, and industrial electronics. By expanding its equipment capabilities, Circuit Technology Center is better positioned to meet increasing customer demand for reliable, precision BGA rework and reballing services.

The addition of a third reflow oven complements Circuit Technology Center’s existing suite of advanced rework, reballing, and PCB repair technologies. The company continues to invest in equipment, engineering expertise, and process development to support increasingly complex electronic assemblies and manufacturing challenges.

With more than 40 years of experience in circuit board repair and rework, Circuit Technology Center provides services including BGA reballing, PCB repair, pad and trace repair, component modification, and engineering support for OEMs and electronics manufacturers worldwide.

For more information about Circuit Technology Center and its BGA reballing services, visit www.circuitrework.com.