Altus Group, a leading supplier of capital equipment and service support for the electronics manufacturing sector in the UK and Ireland, has added the CuttingMaster 3290 laser depaneling system from LPKF to its equipment portfolio.

Depaneling is the process of separating individual circuit boards from a panel once assembly is complete, and it plays a critical role in protecting components and maintaining board integrity at the final stage of production. The addition comes as electronics manufacturers face growing pressure to increase throughput at this stage without compromising cut quality, particularly as assemblies become denser and substrates thicker. While mechanical routing and standard UV laser systems have long served as the default depaneling methods, both face limitations when processing thicker boards at volume, often introducing mechanical stress, debris or slower line speeds.

Joe Booth, CEO at Altus Group, said: “The CuttingMaster 3290 is a genuinely significant step forward for anyone running high-volume production. We’ve seen laser depaneling systems come and go, but this is the first to more than double throughput across all quality levels at full laser power, while still handling FR4 up to 2.4 mm and beyond without carbonisation or heat-affected zones.

“Total cost of ownership is where this system really sets itself apart. Between the extended laser service life and a footprint that beats dual-head alternatives on price-performance, it’s a compelling proposition for production managers who are evaluating cost across the full lifetime of the machine, not just the purchase price.

“I’m confident this will be one of the standout additions to our portfolio this year, and I’m looking forward to showing customers what it can do.”

Built around LPKF’s proprietary Tensor Technology, the CuttingMaster 3290 combines high laser power with advanced beam control to deliver fast, clean cuts across a wide range of substrate types, without the carbonisation or heat-affected zones that compromise yield. The system runs at 90W in combination with Tensor Technology, processing FR4 up to 2.4 mm and above as well as ceramics, flex and rigid-flex substrates, with throughput more than double that of conventional laser depaneling systems. Assembly clearances of up to 40 mm on both the top and bottom side accommodate boards with tall components, while an extended laser service life reduces planned maintenance intervals and replacement costs.

The system is now available through Altus Group for customers across the UK and Ireland, contact Altus for more information.