PHOENIX -- FlipChip International and Kester will collaborate on SE-CURE 7501 low-void wafer bumping paste. Kester, a supplier of solder and related materials and services, has worked with FCI to introduce the solder paste formula designed for wafer bumping. Under the agreement, Kester will manufacture and sell the paste globally.

The paste reportedly features a stable performance down to 70 µm bump heights (corresponding to 135 µm bump pitches) for a consistent printing process. The stable printing provides consistency of bump height across the wafer as well as from wafer to wafer.