COLLEGE PARK, MD - DfR Solutions and Interface Sciences Corp. have begun a joint investigation into potential improvements in CAF resistance through the application of ISC's molecular assembly and deposition technologies.

DfR Solutions, which has extensive experience in CAF experimentation and failure analysis, has identified this technology as a critical link in ensuring CAF robustness in high-density printed boards subjected to Pb-free reflow. The ISC process increases the uniformity and surface density of silane coupling agents on glass reinforcement - up to four times denser - compared with current technology, the companies said in a joint statement. This is expected to improve the intrinsic resistance of the fiber/epoxy bond to hydrolysis and cracking (during drilling), decreasing the influence of manufacturing defects on CAF. In addition, the process enables the deposition of novel surface chemistries that are expected to suppress filament formation. Substantial increases in CAF resistance are expected from the combination of these effects.

 
DFR and Interface are currently establishing supply chain development channels with glass, laminate and PCB manufacturing companies.