SAN JOSE, CA -- Sanmina-SCI Corp. has demonstrated interoperability of its scalable ATCA (Advanced Telecom Computing Architecture) compatible backplane across a spectrum of existing and proposed backplane interconnect standards.
 
"We have completed testing and collected electrical and performance data that demonstrates how Sanmina-SCI's suite of design and manufacturing techniques enhances system-level interoperability," said George Dudnikov, Sr. VP and CTO for the PCB division. "The high-performance market is starting to see some forward momentum, and OEMs are beginning to recognize the performance benefits of using low-distortion interconnects in their systems, which are compatible with drivers and receivers from all major silicon manufacturers. As a result, system designers enjoy a variety of options."
 
The ATCA-compatible backplanes equalize the performance variations seen across major connector technologies (press-fit, SMT, BGA); dielectrics (low-cost and enhanced materials); existing and proposed industry-wide, high-performance interconnect protocols (Ethernet, XAUI, Infiniband, Fibre Channel, Compact PCT, ATCA, VXI, UXPi); modulation schemes (NRZ, PAM, multi-level signaling); and signal-conditioning schemes (passive and active driver pre-emphasis and receiver equalization).