CHANDLER, Ariz., Nov. 8 — Microchip Technology, a provider of microcontroller and analog semiconductors, will in January convert its product packaging to lead-free plating, to comply with pending government regulations.

The company has selected matte tin as its plating material. The finish makes the company's products compatible with tin-lead soldering processes and higher-temperature lead-free processes.

The company has been shipping parts with matte tin plating in volume for over a year, Microchip said.

A number of semiconductor suppliers have announced plans to convert their line cards by the end of the first quarter 2005. See the story in the December issue of Circuits Assembly, coming soon.