Weymouth, UK -- DEK (www.dek.com) has developed a high throughput backside wafer coating process, hosted on a mass imaging platform and capable of exceeding the ± 12.5 µm total thickness variation (TTV) stipulated by most wafer processing specialists. The new process is compatible with underfill or adhesive-type coatings, normally applied at a nominal 50 µm thickness to the backside of semiconductor wafers ahead of singulation.

"TTV is the critical success factor for any backside wafer coating process," said Clive Ashmore of DEK's global applied process engineering group. "By demonstrating our ability to meet the established criteria for backside wafer processing, we have opened new opportunities for semiconductor packaging specialists to increase throughput and reduce the cost per package by using high accuracy mass imaging."

The new process is compatible with the company's metal stencil and emulsion screen technologies.