LPKF Introduces High-Speed Stencil Laser
LPKF Laser & Electronics (Wilsonville, OR) has announced the new MicroCut II, a high-performance stencil laser with a high-resolution scanner. The laser is capable of cutting any shape, including square apertures with rounded corners, at up to 50,000 apertures per hour. This translates to a cutting speed of 11 openings per second.
The high cutting speed is accomplished by a specially-developed system that reduces mechanical movement by moving the laser beam completely independent from the x/y table.
The stencil laser has an aperture resolution of 12.5 nm. It can cut apertures as small as 30 µm and its effective material focus diameter of 20 µm produces sharp contours.
The stencil laser features proprietary PulseShape technology, which eliminates the heat effect that causes coining or warpage of high-density and thin stencils. As a result, no external coolant is required. The system also incorporates new technology that avoids burrs at exiting edges, so no post-treatment is necessary.
System software for laser is optimized for stencil production, processing 500,000 pads in a few minutes.
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