NEMI Plans Tin Whisker Meetings at ECTC
The National Electronics Manufacturing Initiative (NEMI, Herndon, VA) will sponsor a tin whisker workshop and a component supplier/large user meeting at the upcoming IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, NV, June 1-4.
An all-day session on June 1 will review all of the NEMI tin whisker project activities to date. Two half-day sessions are scheduled for June 2. Users and suppliers will discuss mitigation strategies and acceptance test plans for high-reliability critical systems applications in the morning session, followed by an open meeting of the Tin Whisker Accelerated Test Project in the afternoon.
With the move toward lead-free electronics, tin is considered a drop-in replacement for the tin-lead finish currently used for component terminations. However, pure tin coatings may have a tendency to grow small filaments, known as whiskers, which could bridge adjacent terminals, causing system failures. NEMI has three projects that are working on various aspects of this phenomenon: accelerated test (attempting to develop tests to predict tin whiskers), modeling (attempting to understand basic cause of whiskers) and a user group (addressing how high-reliability, long-life systems or critical applications can be protected).
The Tuesday workshop will provide an overview of more than three years' work by the three projects, including discussion of an annotated bibliography, a set of tests recommended to JEDEC, basic theories behind whisker formation and how to protect critical applications and systems given what is known today.
On Wednesday, the Tin Whisker User Group will focus on the need for mitigation practices when pure tin is used as a component terminal coating. The concern with tin whiskers in high-reliability, critical systems applications will be discussed, potential solutions outlined and tests to demonstrate compliance will be proposed.
Carol Handwerker, chief of the Metallurgy Division of the National Institute of Standards and Technology (NIST), will moderate the Tuesday workshop and Wednesday user/supplier discussions on whisker mitigation and test acceptance. Nick Vo, Motorola, will chair the Wednesday test method standardization evaluation and discussions.
All meetings will be held in the same venue as the ECTC. Anyone registered for ECTC can attend the NEMI tin whisker meetings. Individuals wishing to attend only the NEMI meetings should contact the NEMI secretariat for information (703-834-0330).
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