phoenix|x-ray Debuts New 4-In-1 Failure Analysis System
phoenix|x-ray Systems + Services Inc. (Camarillo, CA) has introduced the nanome|x, a high-powered nanofocus four-in-one failure analysis system. The x-ray inspection and failure analysis system can perform sophisticated nondestructive testing processes and resolve minute details. The system is designed to meet manufacturers' requirements of complex semiconductor devices and highly integrated electronic assemblies, yet can be used in the field of micromechanics and material testing as well.
The design is a result of a close partnership with its customers across several fields of applications. As a result, the system uses a high-powered nanofocus tube that can be operated in four modes covering the range from nanometer resolution to high-power radiation. Users can resolve an extreme level of detail (200-300 nm or 0.2-0.3 microns), displaying the slightest defect in miniaturized assemblies, such as pad wetting failures in flip chip solder joints or cracks in bond wires with verifiable results.
The same tube is infinitely variable up to 160kV and can also power up to 50W to see through highly absorbent materials like tungsten alloys used in IC packages or injector nozzles or microelectromechanical systems (MEMS).
The system deploys the company's ovhm|module technology that, without rotation of the board and thus loss of magnification in the oblique, allows for a high magnification (2000x) and 3-D-like imagery with 2-D magnification acquisition speeds. The tube and detector rotate up to 70° around the sample while providing the needed oblique view necessary to see minute defects in small solder joints found in fine-pitch ball grid arrays (FBGAs), microBGAs, column-grid arrays (CGAs), chip-scale packages (CSPs) and flip chips. This option is ideal for determining z-position solder voids, inspecting wetting quality, detecting cracks in bond wires, inspecting BGA device joint stacks and ball bond quality and measurement of via plating in both IC and printed circuit board (PCB) production.
The intensifier in the system is a digital detector technology and video system that delivers distinct images in pseudo real-time of poor absorbing materials with enhanced contrast.
Additional features include the automated inspection of BGA and quad flat pack (QFP) solder joints by an algorithm for the automated pad wetting analysis, software for the automated backend, software for the automated die-attach voiding calculation following user-defined standards and an ergonomic design for comfortable operation.
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