FREMONT, CA – Dage Precision Industries this week released a self-authored reference booklet, High-Speed Bondtesting – Understanding the Technology.

The teaching aid and reference guide provides information about reliability testing of BGA and CSP solder ball interconnections. The contents also include information on the theory and practice of high-speed bondtesting, impact testing applications, evaluation of pad finishes and solder ball alloys, and Pb-free solder ball joint evaluation and brittle fracture joint failure analysis.

The book is 30 pages and illustrated with images and diagrams, and can be obtained by contacting sales@dage-group.com.